等离子刻蚀物的处理Treatment of plasma etchants

等离子刻蚀物的处理

在等离子刻蚀过程中，通过处理气体的作用，被刻蚀物会变成气相（例如在使用氟气对硅刻蚀时）。处理气体和基体物质被真空泵抽出，表面连续被新鲜的处理气体覆盖。不希望被刻蚀部分要使用材料覆盖起来（例如半导体行业用铬做覆盖材料）。

等离子方法也用于刻蚀塑料表面，通过氧气可以灰化填充混合物，同时得到分布分析情况。刻蚀方法在塑料印刷和粘合时作为预处理手段是十分重要的，如POM、PPS和PTFE。等离子处理可以大大地增加粘合润湿面积提高粘合强度。

                                                                 Treatment of plasma etchants

      In the plasma etching process, the etched material will change into the gas phase (e.g. when silicon is etched with fluorine gas). The treatment gas and matrix material are pumped out by vacuum pump, and the surface is continuously covered with fresh treatment gas. The parts that are not to be etched should be covered with materials (for example, the semiconductor industry uses chromium as the covering material).

     The plasma method is also used to etch the plastic surface. The mixture can be ashed by oxygen and the distribution analysis can be obtained at the same time. Etching methods, such as POM, PPS and PTFE, are very important as pretreatment methods in plastic printing and bonding. Plasma treatment can greatly increase the bonding wetting area and improve the bonding strength.