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微波等离子干法去胶机影响因素:Influencing factors of microwave plasma dry degumming machine:

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微波等离子干法去胶机影响因素:Influencing factors of microwave plasma dry degumming machine:

发布日期:2019-08-17 作者:www.cycas.com 点击:

微波等离子干法去胶机影响因素:

干法去胶机

  频率选择:频率越高,氧越易电离形成等离子体。频率太高,以至电子振幅比其平均自由程还短,则电子与气体分子碰撞几率反而减少,使电离率降低。一般常用频率为 13.56MHz及2.45GHZ 。

  功率影响:对于一定量的气体,功率大,等离子体中的的活性粒子密度也大,去胶速度也快;但当功率增大到一定值,反应所能消耗的活性离子达到饱和,功率再大,去胶速度则无明显增加。由于功率大,基片温度高,所以应根据工艺需要调节功率。

  真空度的选择:适当提高真空度,可使电子运动的平均自由程变大,因而从电场获得的能量就大,有利电离。另外当氧气流量一定时,真空度越高,则氧的相对比例就大,产生的活性粒子浓度也就大。但若真空度过高,活性粒子浓度反而会减小。

  氧气流量的影响:氧气流量大,活性粒子密度大,去胶速率加快;但流量太大,则离子的复合几率增大,电子运动的平均自由程缩短,电离强度反而下降。微波等离子去胶机若反应室压力不变,流量增大,则被抽出的气体量也增加,其中尚没参加反应的活性粒子抽出量也随之增加, 因此流量增加对去胶速率的影响也就不甚明显。

Influencing factors of microwave plasma dry degumming machine:

    Frequency selection: the higher the frequency is, the easier oxygen is ionized to form plasma. If the frequency is so high that the amplitude of the electron is shorter than its average free path, the probability of collision between the electron and the gas molecule will be reduced, and the ionization rate will be reduced. Generally, the commonly used frequencies are 13.56MHz and 2.45GHz.

   Power effect: for a certain amount of gas, the power is high, the density of the active particles in the plasma is high, and the degumming speed is fast; however, when the power increases to a certain value, the active ions consumed by the reaction reach saturation, and the degumming speed does not increase significantly when the power is higher. Because of the high power and substrate temperature, the power should be adjusted according to the process requirements.

  Selection of vacuum degree: if the vacuum degree is properly increased, the average free path of electron motion will be enlarged, so the energy obtained from the electric field will be larger, which is favorable for ionization. In addition, when the oxygen flow rate is constant, the higher the vacuum degree is, the larger the relative proportion of oxygen is, and the greater the concentration of active particles is. However, if the vacuum is too high, the concentration of active particles will decrease.

  The influence of oxygen flow rate: large oxygen flow rate, high density of active particles, faster degumming rate; but too large flow rate, the probability of ion recombination increases, the average free path of electron motion shortens, and the ionization intensity decreases. If the pressure of the reaction chamber and the flow rate of the microwave plasma degummer are constant, the amount of gas pumped out will also increase, and the amount of active particles that have not participated in the reaction will also increase, so the effect of the flow rate increase on the degumming rate is not obvious.


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