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微波等离子去胶机工作原理及应用Working principle and application of microwave plasma degummer

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微波等离子去胶机工作原理及应用Working principle and application of microwave plasma degummer

发布日期:2018-10-08 作者:www.cycas.com 点击:

 1) 微波等离子去胶机理:

  在干法等离子去胶工艺中,氧是主要腐蚀气体。它在真空等离子去胶机反应室中受高频及微波能量作用,电离产生氧离子、游离态氧原子 O*、氧分子和电子等混合的等离子体,其中具有强氧化能力的游离态氧原子 (约占 10-20%)在高频电压作用下与光刻胶膜反应: O2→O*+ O*, CxHy + O*→CO2↑+ H2O↑。反应后生成的 CO2 和 H2O,随即被抽走。

  2) 微波等离子去胶机操作方法:

  将待去胶片插入石英舟并平行气流方向,推入真空室两电极间,抽真空到 1.3Pa,通入适量氧气,保持反应室压力在 1.3-13Pa,加高频功率,在电极间产生淡紫色辉光放电,通过调节功率、流量等工艺参数,可得不同去胶速率,当胶膜去净时,辉光消失。

干法去胶机

  3)微波等离子干法去胶机影响因素:

  频率选择:频率越高,氧越易电离形成等离子体。频率太高,以至电子振幅比其平均自由程还短,则电子与气体分子碰撞几率反而减少,使电离率降低。一般常用频率为 13.56MHz及2.45GHZ 。

  功率影响:对于一定量的气体,功率大,等离子体中的的活性粒子密度也大,去胶速度也快;但当功率增大到一定值,反应所能消耗的活性离子达到饱和,功率再大,去胶速度则无明显增加。由于功率大,基片温度高,所以应根据工艺需要调节功率。

  真空度的选择:适当提高真空度,可使电子运动的平均自由程变大,因而从电场获得的能量就大,有利电离。另外当氧气流量一定时,真空度越高,则氧的相对比例就大,产生的活性粒子浓度也就大。但若真空度过高,活性粒子浓度反而会减小。

  氧气流量的影响:氧气流量大,活性粒子密度大,去胶速率加快;但流量太大,则离子的复合几率增大,电子运动的平均自由程缩短,电离强度反而下降。微波等离子去胶机若反应室压力不变,流量增大,则被抽出的气体量也增加,其中尚没参加反应的活性粒子抽出量也随之增加, 因此流量增加对去胶速率的影响也就不甚明显。

      1) Mechanism of microwave plasma degumming:

in dry plasma degumming process, oxygen is the main corrosive gas. Under the action of high frequency and microwave energy in the reaction chamber of vacuum plasma degummer, it ionizes to produce a plasma mixed with oxygen ion, free oxygen atom o *, oxygen molecule and electron, among which the free oxygen atom with strong oxidation ability (about 10-20%) reacts with photoresist film under the action of high frequency voltage: O2 → o * + O *, CxHy + O * → CO2 ↑ + H2O ↑. After reaction, CO2 and H2O are extracted.

     2) Operation method of microwave plasma degumming machine:

insert the film to be removed into the quartz boat and parallel to the air flow direction, push it into the space between the two electrodes of the vacuum chamber, vacuumize to 1.3pa, inject appropriate amount of oxygen, and keep the pressure of the reaction chamber at 1.3-13pa, add high-frequency power, generate a lavender glow discharge between the electrodes. By adjusting the process parameters such as power and flow, different degumming rates can be obtained. When the film is degummed, the glow disappears. 

    3) Microwave plasma dry degumming machine influencing factors:

frequency selection: the higher the frequency, the easier oxygen ionization to form plasma. If the frequency is so high that the amplitude of the electron is shorter than its average free path, the probability of collision between the electron and the gas molecule will be reduced, and the ionization rate will be reduced. Generally, the commonly used frequencies are 13.56MHz and 2.45GHz. 

   Power effect: for a certain amount of gas, the power is high, the density of the active particles in the plasma is high, and the degumming speed is fast; however, when the power increases to a certain value, the active ions consumed by the reaction reach saturation, and the degumming speed does not increase significantly when the power is higher. Because of the high power and substrate temperature, the power should be adjusted according to the process requirements.

  Selection of vacuum degree: if the vacuum degree is properly increased, the average free path of electron motion will be enlarged, so the energy obtained from the electric field will be larger, which is favorable for ionization. In addition, when the oxygen flow rate is constant, the higher the vacuum degree is, the larger the relative proportion of oxygen is, and the greater the concentration of active particles is. However, if the vacuum is too high, the concentration of active particles will decrease. The            Influence of oxygen flow rate: large oxygen flow rate, high density of active particles, faster degumming rate; but too large flow rate, the probability of ion recombination increases, the average free path of electron motion shortens, and the ionization intensity decreases. If the pressure of the reaction chamber and the flow rate of the microwave plasma degummer are constant, the amount of gas pumped out will also increase, and the amount of active particles that have not participated in the reaction will also increase, so the effect of the flow rate increase on the degumming rate is not obvious.


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