语言
Magnetron sputtering (磁控溅射台))

新闻资讯

热门关键词

联系我们

名 称:苏州赛森电子科技有限公司

电 话:0512-58987901

传 真:0512-58987201

邮 箱:sales@cycas.com

地 址:江苏省张家港经济开发区福新路1202号 215600PRC

网 址:www.cycas.com

Name: Suzhou cycas  Microelectronics Co., Ltd.

Tel.: 0512-58987901

Fax: 0512-58987201

Email: sales@cycas.com

Address: No.1202,Fuxin Road,Zhangjiagang Economic Development Zone,Jiangsu Province 215600PRC

Website: www.cycas.com 

感应耦合等离子体刻蚀机结构Structure of inductively coupled plasma etcher

您的当前位置: 首 页 >> 新闻资讯 >> 技术知识

感应耦合等离子体刻蚀机结构Structure of inductively coupled plasma etcher

发布日期:2018-06-09 作者:www.cycas.com 点击:

感应耦合等离子刻蚀机(Inductively CoupledPlasma Etch,简称ICPE)是化学过程和物理过程共同作用的结果。它的基本原理是在真空低气压下,ICP 射频电源产生的射频输出到环形耦合线圈,以一定比例的混合刻蚀气体经耦合辉光放电,产生高密度的等离子体,在下电极的RF 射频作用下,这些等离子体对基片表面进行轰击,基片图形区域的半导体材料的化学键被打断,与刻蚀气体生成挥发性物质,以气体形式脱离基片,从真空管路被抽走。

等离子刻蚀机

结构

ICP 设备主要包括预真空室、刻蚀腔、供气系统和真空系统四部分。

(1)预真空室

预真空室的作用是确保刻蚀腔内维持在设定的真空度,不受外界环境(如:粉尘、水汽)的影响,将危险性气体与洁净厂房隔离开来。它由盖板、机械手、传动机构、隔离门等组成。

(2)刻蚀腔体

刻蚀腔体是ICP 刻蚀设备的核心结构,它对刻蚀速率、刻蚀的垂直度以及粗糙度都有直接的影响。刻蚀腔的主要组成有:上电极、ICP 射频单元、RF 射频单元、下电极系统、控温系统等组成。

(3)供气系统

供气系统是向刻蚀腔体输送各种刻蚀气体,通过压力控制器(PC)和质量流量控制器(MFC)精准的控制气体的流速和流量。气体供应系统由气源瓶、气体输送管道、控制系统、混合单元等组成。

(4)真空系统

真空系统有两套,分别用于预真空室和刻蚀腔体。预真空室由机械泵单独抽真空,只有在预真空室真空度达到设定值时,才能打开隔离门,进行传送片。刻蚀腔体的真空由机械泵和分子泵共同提供,刻蚀腔体反应生成的气体也由真空系统排空

    Inductively coupled plasma etch (ICPE) is the result of chemical and physical processes. Its basic principle is that under vacuum and low pressure, the RF generated by ICP RF power is output to the ring coupling coil, and a certain proportion of mixed etching gas is discharged by coupling glow discharge to produce high-density plasma, RF at the lower electrode Under RF, these plasmas bombard the surface of the substrate. The chemical bond of the semiconductor material in the pattern area of the substrate is interrupted, and volatile substances are generated with the etching gas, which is separated from the substrate in the form of gas, and then pumped out from the vacuum pipeline.

    The structural ICP equipment consists of four parts: pre vacuum chamber, etch chamber, air supply system and vacuum system.

    (1) The function of the pre vacuum chamber is to ensure that the etching chamber is maintained in the set vacuum degree, and is not affected by the external environment (such as dust and water vapor), so as to separate the dangerous gas from the clean workshop. It consists of cover plate, manipulator, transmission mechanism, isolation door, etc

   (2) Etching cavity is the core structure of ICP etching equipment, which has a direct impact on etching rate, perpendicularity and roughness. The main components of the etching chamber are: upper electrode, ICP RF unit, RF RF unit, lower electrode system, temperature control system, etc.

   (3) The gas supply system of the gas supply system is to deliver various etching gases to the etching cavity, and precisely control the gas flow rate and flow rate through the pressure controller (PC) and the mass flow controller (MFC). The gas supply system consists of gas source bottle, gas transmission pipeline, control system, mixing unit, etc.

   (4) There are two sets of vacuum system in vacuum system, which are used for pre vacuum chamber and etching chamber respectively. The pre vacuum chamber is vacuumized by a mechanical pump. Only when the vacuum degree of the pre vacuum chamber reaches the set value, can the isolation door be opened and the transfer piece be carried out. The vacuum of etching cavity is provided by mechanical pump and molecular pump, and the gas generated by the reaction of etching cavity is also drained by vacuum system.


本文网址:http://www.cycas.com/news/380.html

相关标签:等离子刻蚀机

最近浏览: