等离子刻蚀机的应用Application of plasma etcher

等离子体处理可应用于所有的基材，甚至复杂的几何构形都可以进行等离子体活化、等离子体清洗，等离子体镀膜也毫无问题。等离子体处理时的热负荷及机械负荷都很低，因此，低压等离子体也能处理敏感性材料。等离子刻蚀机的典型应用包括：

等离子体清除浮渣

光阻材料剥离

表面处理

各向异性和各向同性失效分析应用材料改性

包装清洗

钝化层蚀刻

聚亚酰胺蚀刻

增强粘接力

生物医学应用

聚合反应

混合物清洗

预结合清洗

Plasma treatment can be applied to all substrates, even complex geometry can be plasma activated, plasma cleaning, plasma coating is no problem. The heat load and mechanical load of plasma treatment are very low, so low pressure plasma can also treat sensitive materials. Typical applications of plasma etchers include:

Removal of scum by plasma

Photoresist stripping

surface treatment

Anisotropic and isotropic failure analysis using material modification

Packaging cleaning

Passivation layer etching

Polyimide etching

Enhance adhesion

Biomedical applications

Polymerization

Mixture cleaning

Pre combined cleaning