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反应离子刻蚀机检验操作及判断Inspection operation and judgment of reactive ion etching machine

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反应离子刻蚀机检验操作及判断Inspection operation and judgment of reactive ion etching machine

发布日期:2018-01-04 作者:www.cycas.com 点击:

      反应离子刻蚀机是一款独立式RIE反应离子刻蚀系统,配套有淋浴头气体分布装置以及水冷RF样品。具有不锈钢柜子以及13"的上盖式圆柱形铝腔,便于晶圆片装载.腔体有两个端口:一个带有2"的视窗,另一个空置用于诊断。反应离子刻蚀机可以支持最大到12"的晶圆片。腔体为超净设计,并且根据配套的真空泵可以达到10-6 Torr 或更小的极限真空。反应离子刻蚀机系统可以在20mTorr到8Torr之间的真空下工作。真空泵组包含一个节流阀,一个250l/s的涡轮分子泵,滤网过滤器,以及一个10cfm的机械泵(带Formblin泵油)。RF射频功率通过600W,13.56MHz的电源和自动调谐器提供。系统将持续监控直流自偏压,该自偏压可以高达-500V,这对于各向异性的刻蚀至关重要。

等离子刻蚀机

    反应等离子刻蚀机是基于PC控制的全自动系统。系统真空压力及DC直流偏压将以图形格式实时显示,流量及功率则以数字形式实时显示。系统提供密码保护的四级访问功能:操作员级、工程师级、工艺人员级,以及维护人员级。允许半自动模式(工程师模式)、写程序模式(工艺模式),和全自动执行程序模式(操作模式)运行系统。基于全自动的控制,该系统具有高度的可重复性。

    

反应离子刻蚀机检验操作及判断

    1. 确认万用表工作正常,量程置于200mV。

    2.冷探针连接电压表的正电极,热探针与电压表的负极相连。

    3.用冷、热探针接触硅片一个边沿不相连的两个点,电压表显示这两点间的电压为正值,说明导电类型为P 型,刻蚀合格。相同的方法检测另外三个边沿的导电类型是否为P型。

    4.如果经过检验,任何一个边沿没有刻蚀合格,则这一批硅片需要重新装片,进行刻蚀。

主营导航:热真空系统,光学元件镀膜机,单片晶圆清洗机,进口微波去胶机,进口双模式刻蚀机

    Reactive ion etcher is an independent RIE reactive ion etching system, which is equipped with shower head gas distribution device and water-cooled RF sample. It has a stainless steel cabinet and a 13 "top cover cylindrical aluminum cavity for wafer loading. The cavity has two ports: one with a 2" window and the other empty for diagnosis. Reactive ion etchers can support up to 12 "wafer sizes. The cavity is of super clean design, and the limit vacuum of 10-6 torr or less can be achieved according to the matching vacuum pump. The reactive ion etching system can work in a vacuum between 20 and 8 Torr. The vacuum pump set consists of a throttle valve, a 250L / s turbo molecular pump, a strainer filter, and a 10cfm mechanical pump (with formblin pump oil). RF RF power is provided by 600W, 13.56MHz power supply and auto tuner. The system will continuously monitor the DC self bias voltage, which can be as high as - 500V, which is very important for anisotropic etching. 

   Reactive plasma etching machine is a fully automatic system based on PC control. The vacuum pressure and DC bias of the system will be displayed in graphic format in real time, and the flow and power will be displayed in digital format in real time. The system provides four level access functions of password protection: operator level, engineer level, process personnel level, and maintenance personnel level. Allow semi-automatic mode (Engineer mode), write program mode (process mode), and fully automatic execution program mode (operation mode) to run the system. Based on the fully automatic control, the system has a high degree of repeatability. 

Check operation and judgment of reactive ion etching machine 

  1. Confirm that the multimeter works normally and the range is set at 200mV.

  2. The cold probe is connected to the positive electrode of the voltmeter, and the hot probe is connected to the negative electrode of the voltmeter.

  3. Use cold and hot probes to contact two points on one edge of the silicon wafer that are not connected. The voltmeter shows that the voltage between the two points is positive, indicating that the conductive type is p-type, and the etching is qualified. The same method is used to detect whether the conductive type of the other three edges is p-type.

  4. If any edge is not etched as qualified after inspection, this batch of silicon wafers need to be reloaded for etching. Main navigation: thermal vacuum system, optical element coating machine, single wafer cleaning machine, imported microwave degumming machine, imported dual-mode etching machine


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