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Magnetron sputtering (磁控溅射台))

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什么是全自动型磁控溅射台?What is a fully automatic magnetron sputtering table?

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什么是全自动型磁控溅射台?What is a fully automatic magnetron sputtering table?

发布日期:2018-04-08 作者:www.cycas.com 点击:

什么是全自动型磁控溅射台?

磁控溅射是为了在低气压下进行高速溅射,必须有效地提高气体的离化率。通过在靶阴极表面引入磁场,利用磁场对带电粒子的约束来提高等离子体密度以增加溅射率的方法, 全自动型磁控溅射台,通过对真空系统,下游压力闭环控制,射频电源,气体流量及工艺过程的全自动控制,以及所安全互锁,智能监控,在线状态记忆,断电保护等.现在很多国产厂家都能做到这些功能

技术分类

可以分为直流磁控溅射法和射频磁控溅射法。

磁控溅射台

特点介绍

全自动磁控溅射台采用PLC控制,触摸显示屏操作,其数字号参数界面和自动化操作方式为用户提供优良的研发和生产平台.

主要用途

     全自动磁控溅射台可在硅片、塑料、陶瓷、玻璃、石英、Ⅲ-Ⅴ族化合物及金属等材料表面镀制AI、Au、Cr、Ti、Ni、Cu、W、SiO2、各种金属、非金属,单层、多层膜。它具有均匀性好、溅射速率高、基片升温低、靶材节省等特点。

使用范围

本设备主要用于微电子、光电子、通讯、微机械等领域的器件研发和制造。

What is a fully automatic magnetron sputtering table? 

    Magnetron sputtering is for high-speed sputtering at low pressure, so it is necessary to effectively improve the gas ionization rate. By introducing a magnetic field on the cathode surface of the target and using the restriction of the magnetic field on the charged particles to improve the plasma density and increase the sputtering rate, the full-automatic magnetron sputtering table can control the vacuum system, downstream pressure closed-loop control, RF power supply, gas flow and process automatically, as well as the safety interlock, intelligent monitoring and online state memory, Now many domestic manufacturers can do these functional technology 

   Classification can be divided into DC magnetron sputtering and RF magnetron sputtering. 

   Features: the automatic magnetron sputtering table is controlled by PLC and operated by touch screen, Its digital parameter interface and automatic operation mode provide users with an excellent R & D and production platform. 

   Its main purpose is to prepare AI, Au, Cr, Ti, Ni, Cu, W, SiO2, various metals, nonmetals, single-layer and multi-layer films on the surface of silicon, plastic, ceramics, glass, quartz, Ⅲ - Ⅴ group compounds and metals. It has the advantages of good uniformity, high splash rate, low substrate temperature rise and target saving. 

  Scope of application: This equipment is mainly used in the research, development and manufacturing of devices in the fields of microelectronics, optoelectronics, communication, micro machinery, etc.

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