磁控溅射台设备用途和功能特点Application and function of magnetron sputtering equipment

磁控溅射台设备用途和功能特点 

　  1、该设备是一种多功能磁控溅射镀膜设备，适用于镀制各种单层膜、多层膜及搀杂膜系。可镀金属、合金、化合物、半导体、陶瓷膜(需配射频电源)、介质复合膜和其它化学反应膜。

　　2、为避免微粒物资落到基片上，采用基片在上、磁控溅射靶在下的结构，即由下向上溅射。3、为满足镀制搀杂膜的要求，采用多靶向心溅射的方式。

　　4、可以采用单靶独立、双靶、三靶任意轮流或组合共溅工作模式，射频直流兼容。

　　5、所有靶面均可以沿轴向位移，与真空室轴夹角70o，位移量±50mm，可变角度±15o。所有靶上都带有电动档板，以防止靶面在未工作时被污染。这一功能为寻找实验参数提供了强有力的实验手段。

　　6、为了保证镀膜的工艺性（预溅射、多层膜、搀杂膜、防止交叉污染和干扰等），每只磁控溅射靶均配备磁力耦合电动挡板（配装电机），可在操作面板上电动控制靶挡板的开关。

　　7、基片加热器采用高纯石墨加热器，可以避免加热元件放气或挥发对基片和真空室的污染，加热器的可靠性高，寿命长。

　　8、由于采用了超高真空密封技术，极限真空度高，可达2×10-5Pa，可保证更高的镀膜纯净度，提高镀膜质量。

　　恢复工作真空时间短，从大气到工作真空（7×10-4Pa）时间30～40分钟（充干燥氮气）

　　运动部件的密封，采用磁力耦合动密封技术。

　　真空规用金属规（不用玻璃规），密封口用刀口金属密封结构。

1. This equipment is a multi-functional magnetron sputtering coating equipment, suitable for plating various single-layer film, multilayer film and mixed film system. It can be plated with metals, alloys, compounds, semiconductors, ceramic films (with RF power supply), composite films and other chemical reaction films. 

2. In order to avoid the particle materials falling on the substrate, the structure of substrate on top and magnetron sputtering target on the bottom is adopted, that is, sputtering from the bottom up.

3. In order to meet the requirements of the mixed films, multi-target centripetal sputtering was used.

4. It can use single target independent, double target, three target random rotation or combination of common splash mode, RF DC compatible.

   5. All target surfaces can be displaced along the axial direction, with an angle of 70O, a displacement of ± 50mm and a variable angle of ± 15O. All targets are equipped with electric baffles to prevent the target surface from being polluted when it is not working. This function provides a powerful experimental means for finding experimental parameters. 

   6. Each magnetron sputtering target is equipped with a magnetic coupling electric baffle (equipped with a motor) to ensure the coating process (pre sputtering, multi-layer film, mixed film, prevention of cross contamination and interference, etc.), and the switch of the baffle can be electrically controlled on the operation panel. 

   7. The substrate heater adopts high-purity graphite heater, which can avoid the pollution of substrate and vacuum chamber caused by the outgassing or volatilization of heating elements. The heater has high reliability and long service life.

   8. Due to the use of ultra-high vacuum sealing technology, the ultimate vacuum degree is high, up to 2 × 10-5pa, which can ensure a higher purity of the coating and improve the quality of the coating. 

     The time from atmosphere to working vacuum (7 × 10-4Pa) is 30-40 minutes (filled with dry nitrogen). 

     The magnetic coupling dynamic sealing technology is adopted. The vacuum gauge uses a metal gauge (no glass gauge), and the sealing edge uses a knife edge metal sealing structure.