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干法去胶工艺原理及使用?Principle and application of dry degumming process?

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干法去胶工艺原理及使用?Principle and application of dry degumming process?

发布日期:2019-09-16 作者:www.cycas.com 点击:

大气等离子处理器让生产成本和产品价格下降

   等离子加工机是工件的等离子体表面处理的表面,使工件的表面,以增强附着力,便于包装和粘附性,这是非常重要的在包装印刷行业。因为在等离子表面处理设备前就没有出现糊大大提高印刷和包装行业的工作效率,但由于粘贴太快的转速,在工作过程中,有很多包装不粘,浪费了大量的材料,生产成本和包装印刷业一直是高。由于等离子体表面处理设备的出现,使包装行业大大降低了刷的成本。

   有等离子体表面处理设备

第一许多特点:工件的加工深度的表面很小,但是很均匀。

二:是绿色的整个治疗过程中,无纸等杂物碎片。

第三:等离子表面处理设备是非常稳定的,因为等离子表面处理设备在工作时接近工件,但工件表面通过喷嘴降低等离子喷涂的温度,从而保证的连续性和均匀性。


1) 等离子干法去胶机反应机理:

   在干法等离子去胶技术中,氧是首要腐蚀气体。它在真空等离子去胶机反响室中受高频及微波能量效果,电离发生氧离子、游离态氧原子 O*、氧分子和电子等混合的等离子体,其间具有强氧化才能的游离态氧原子 (约占 10-20%)在高频电压效果下与光刻胶膜反响: O2→O*+ O*, CxHy + O*→CO2↑+ H2O↑。反应后生成的 CO2 和 H2O,随即被抽走。

2) 等离子去胶操作方法:

   将待去胶片插入石英舟并平行气流方向,推入真空室两电极间,抽真空到 1.3Pa,通入恰当氧气,坚持反响室压力在 1.3-13Pa,加高频功率,在电极间发生淡紫色辉光放电,经过调理功率、流量等技术参数,可得不一样去胶速率,当胶膜去净时,辉光不见。

3)等离子去胶影响要素:

   频率挑选:频率越高,氧越易电离构成等离子体。频率太高,以致电子振幅比其平均自由程还短,则电子与气体分子磕碰概率反而减少,使电离率降低。通常常用频率为 13.56MHz及2.45GHZ 。

   功率影响:关于必定量的气体,功率大,等离子体中的的活性粒子密度也大,去胶速度也快;但当功率增大到必定值,反响所能耗费的活性离子到达饱满,功率再大,去胶速度则无显着添加。由于功率大,基片温度高,所以应根据技术需求调理功率。

   真空度的挑选:恰当进步真空度,可使电子运动的平均自由程变大,因而从电场取得的能量就大,有利电离。别的当氧气流量必守时,真空度越高,则氧的相对份额就大,发生的活性粒子浓度也就大。但若真空度过高,活性粒子浓度反而会减小。

氧气流量的影响:氧气流量大,活性粒子密度大,去胶速率加速;但流量太大,则离子的复合概率增大,电子运动的平均自由程缩短,电离强度反而降低。若反响室压力不变,流量增大,则被抽出的气体量也添加,其间尚没参与反响的活性粒子抽出量也随之添加, 因而流量添加对去胶速率的影响也就不甚显着。

                          Atmospheric plasma processor reduces production cost and product price

       Plasma machine is the surface of workpiece treated by plasma, which makes the surface of workpiece to enhance adhesion, facilitate packaging and adhesion, which is very important in packaging and printing industry. Because paste did not appear before plasma surface treatment equipment to greatly improve the working efficiency of printing and packaging industry, but because of the fast speed of paste, in the process of work, there are many packages that are not sticky and waste a lot of materials, and the production cost and packaging printing industry has been high. Due to the appearance of plasma surface treatment equipment, the packaging industry has greatly reduced the cost of brush.

There are many characteristics of plasma surface treatment equipment

First :the machining depth of the workpiece surface is very small, but very uniform.

2: It is a green whole treatment process without paper and other debris.

Third: the plasma surface treatment equipment is very stable, because the plasma surface treatment equipment is close to the workpiece when working, but the workpiece surface reduces the temperature of plasma spraying through the nozzle, so as to ensure the continuity and uniformity.

1) Reaction mechanism of plasma dry degumming machine: in dry plasma degumming technology, oxygen is the primary corrosive gas. It receives high frequency and microwave energy effect in the reaction chamber of vacuum plasma degummer, ionizes and produces plasma mixed with oxygen ion, free oxygen atom o *, oxygen molecule and electron, among which free oxygen atom with strong oxidation ability (about 10-20%) reacts with photoresist film under high frequency voltage effect: O2 → o * + O *, CxHy + O * → CO2 ↑ + H2O ↑. After reaction, CO2 and H2O are extracted.

2) Operation method of plasma degumming: insert the film to be removed into the quartz boat and parallel to the air flow direction, push it into the space between the two electrodes of the vacuum chamber, vacuumize to 1.3pa, inject appropriate oxygen, and keep the pressure of the reaction chamber at 1.3-13pa, add high-frequency power, generate lavender glow discharge between electrodes. After adjusting technical parameters such as power, flow, etc., different degumming rate can be obtained. When the film is degummed, the glow is not seen.

3) Factors affecting plasma degumming: frequency selection: the higher the frequency is, the easier oxygen is ionized to form plasma. If the frequency is too high, the amplitude of the electron is shorter than its average free path, the probability of collision between the electron and the gas molecule will be reduced, and the ionization rate will be reduced. The commonly used frequencies are 13.56MHz and 2.45GHz. Power effect: for a certain amount of gas, the power is high, the density of the active particles in the plasma is also high, and the degumming speed is fast; but when the power is increased to a certain value, the active ions consumed by the reaction will be full, and the degumming speed will not be significantly increased if the power is higher. Because of the high power and substrate temperature, the power should be adjusted according to the technical requirements. Selection of vacuum degree: if the vacuum degree is improved properly, the average free path of electron motion will be enlarged, so the energy obtained from the electric field will be larger, which is favorable for ionization. In addition, when the oxygen flow must be constant, the higher the vacuum degree is, the larger the relative share of oxygen will be and the concentration of active particles will be. However, if the vacuum is too high, the concentration of active particles will decrease. The influence of oxygen flow rate: large oxygen flow rate, high density of active particles, accelerated degumming rate; but too large flow rate, the ion recombination probability increases, the average free path of electron motion shortens, and the ionization intensity decreases. If the pressure of the reaction chamber is constant and the flow rate increases, the amount of gas pumped out will be added, and the amount of active particles that have not participated in the reaction will also be added, so the effect of flow rate addition on the degumming rate is not significant.



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